(1) The front channel copper interconnection electroplating equipment is aimed at the Ultra ECP map of the front channel copper interconnection electroplating technology of 55NN, 40nm, 28nm and 20-14nm below the technical node. It is mainly used to precipitate a layer of dense, no holes, no gaps and other defects and evenly distributed copper on the wafer.  It can be used in logic circuit and storage circuit with double damasque copper plating process.  (2) After advanced packaging electroplating equipment for advanced packaging electroplating needs for differentiated development, suitable for high current high-speed electroplating applications, and the modular design is easy to maintain and control, reduce equipment maintenance time, improve the utilization rate of equipment.  Can be used in advanced packaging Pillar Bump, RDL, HD Fan-Out and TSV, copper, nickel, tin, silver, gold plating processes.