（1）This equipment is for magnetron sputtering process, can be used for 4 ", 6", 8 ", 12" wafer.
（2）It can coat film materials such as Al, Au, Pt, Cr, Ti, Ni, Cu, NiCr, TiW, W, SiO2, Al2O3, TaN, ITO, LCO, LiP, etc.
（3）Through the stable and reliable high-precision vacuum robot arm, the substrate is transferred between the process chamber and the transfer chamber, so it can producte continuously without atmosphere in the process chamber. It is equipped with high-performance sputtering target head, which can be customized according to customer needs.